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晶圆划片

¥1,500.00

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分类：封装测试

描述

描述

技术指标

晶圆尺寸: 2, 4, 6, 8英寸晶圆及碎片
晶圆厚度: 0.1-1.5mm
定位精度：3um
Z轴重复精度：1um