晶圆CMP机械化学平坦化 
湿法清洗及腐蚀
¥1,500.00
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描述
技术指标
- 晶圆尺寸: 2, 4, 6英寸晶圆及碎片
- RCA清洗：DHF+SPM+SC1+SC2
- 湿法去胶：NMP
- 氧化物湿法刻蚀: HF or BOE + SC1
- 前段poly/oxide去除：HF/HNO3+HF+SC1+SC2
- 后段金属膜层去除：SPM+HF+SC1
¥1,500.00
Free shipping on orders over $50!
技术指标
