晶圆植球
¥1,500.00
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Description
技术指标
- 晶圆尺寸: 2, 4, 6, 8英寸晶圆及碎片
- Wire Size: 20.3 um ( 0.8 mil ) ～ 50.8 um ( 2 mil ) Au
- Bonding Speed：50 ms.per bump
- Bonding Accuracy: +/- 3.5 um. @ 3 sigma
